The outer edges of the cut wafers are particularly sharp. Wafer chamfering and rounding are usually made of curved cutting or internal dicing saw blades. Wafers produce tiny control circuit structures through a series of semiconductor manufacturing processes, and then through cutting, Packaging, and testing become chips, which are widely used in various electronic instruments. High-purity semiconductor materials are made into wafers through processes such as crystal pulling and slicing. Wafers are the basic raw materials for the production of semiconductor devices. In this process, the wafer is cut into a number of hexahedral shape of the single chip, the process is called “Singulaton”, and the process of Sawing the wafer into a rectangular shape is called “Die Sawing”. In the second step, a transistor is engraved on the front of the wafer by the previous step.įinally, the wafer is packaged, that is, cut through the process to make a complete semiconductor chip. A wafer goes through three changes before it becomes a real semiconductor chip:įirst, semiconductor chip is cut from a lump of ingots into wafers.
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